Printed Circuit Board Solutions

As a buyer or design engineer, your challenge is to find high quality, competitively priced printed circuit boards and interconnect solutions for your end product. With over 25 years of experience in PCB technology, design optimization, and manufacturability, VEXOS’ dedicated team of PCB professionals will provide you with the most innovative and cost-effective solutions for your front-end design through mass production.

Complementing our PCB manufacturing expertise, VEXOS offers North American customer support together with offshore production facilities that provide our customers the support and pricing required to remain competitive in today’s market.

Competitive Prices

Our experienced team of PCB professionals works closely with state-of-the-art manufacturing partners to offer the most competitive prices in the market while ensuring that all boards are built to global quality standards. With extensive knowledge of industry requirements and specifications, the VEXOS PCB team will also assist with design and engineering specifications to improve manufacturability and help identify cost reduction opportunities.
From the moment you contact us about a new or existing project up to the time we deliver, our focus will remain on providing the best quality and service. Our team of experienced sales staff, account managers, planners/schedulers and technical support engineers are always ready to ensure that all of your needs are met and keep you ahead of your competition.

RFQ/sample/first article inspection
Design for manufacturing (DFM) review
Check plot review/approvals
Production purchase order management
Schedule changes/expedites
Freight/logistics coordination
Quality commitment

PCB Design Optimization and Manufacturing Solutions

Learn from our team of experts having 30+ years of experience in PCB design optimization, technology, and manufacturing.

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PCB Solutions - Advanced Technology

From standard technology to complex, high-density circuits incorporating the latest technology, VEXOS will keep you up-to-date with cutting edge advancements available in the market today.

Conventional rigid circuits
Rigid circuits with buried via holes and blind via holes
HDI rigid circuit with 1+n+1 / 2+n+2 / 3+n+3 / ELIC structure
Semi-flex PCBs
RF PCBs
Flex circuits
Rigid-flex circuits
Thermal clad
Metal, Aluminum, Copper, Ceramic and steel based PCBs
Heavy Copper and bondable PCBs

Capabilities

Rapid prototyping
Rigid boards from 1 to 48 layers
Flex circuits from 1 to 8 layers
HDI from 4 to 20 layers
Rigid-Flex from 4 to 16 layers with laser drills
Controlled Impedance: +/-8%
Thin laminate capability down to 2 mil
HAL, lead-free HAL, Flash gold, ENIG, ENEPIG, gold finger plating, selective gold plating, Entek, immersion tin, immersion, silver surface finishes
Silver ink through holes, silver and carbon ink jumper, carbon printing, peelable solder mask
Materials: CEM-1, CEM-3, FR-1, FR-2, FR-4, FR-5 (High Tg), High Tg Material (Tg = 180º C), BT, Rogers, Panasonic, ISOLA, polyamide, and ceramic material
Finished board thickness: 0.25 mm / 0.010 inch to 7.0 mm / 0.275 inch
Copper thickness up to 10 oz
Hole size: 0.1 mm/0.004 inch minimum for laser vias, and 0.15 mm/0.006 minimum for mechanic drilling
Trace size: 0.076 mm/0.003 inch minimum for conventional PCBs, 0.05mm/0.002 minimum for HDI/ELIC
Trace spacing: 0.076 mm/0.003 inch minimum for conventional PCBs, 0.05mm/0.002 minimum for HDI/ELIC
Aspect ratio: 15:1