June 06, 2018
Success with FLEX
by Stephen Las Marias for I-CONNECT007.
In an interview with SMT007 Magazine, Harry Chan, Deputy GM and VP Manufacturing Shenzhen
at Vexos, speaks about the challenges when dealing with flexible circuit assemblies, and strategies and techniques to address them.
Stephen Las Marias: What’s driving the increasing demand for flex and flex assemblies?
Harry Chan: The major factor for flex circuits is new technology and the need to work with
PCBAs that can be manipulated to conform to the finished product. Also, moving to smaller
devices means limited space allocation for key components. As OEMs and device manufacturers
work with smaller components for their products, flex circuits provide a viable solution.