Printed Circuit Board Assembly PCBA

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Printed Circuit Board Solutions (PCB)

Choosing the Right Solution for Your Needs

 

Flexible PCBs are used in a variety of different applications such as portable electronics, devices, hard dish drives and desktop printers

 

Rigid PCBs are designed for applications that have complicated circuit layouts or need many electric components mounted. This type of PCB offers high durability, reliability and a long life cycle, which is why they are often used in LEDs, as well as automotive, medical, HVAC, fitness equipment and industrial applications.

 

Rigid-flex PCBs maximize space and greatly improve reliability. This type of PCB is designed for advanced electrical applications such as testing equipment, tools and automobiles. In addition, rigid-flex PCBs are used in medical devices such as pacemakers, because of their space and weight reduction capabilities.

 

Aluminum/metal clad circuit boards are used a base metal material to assist with the heat dissipation of the circuit board. Metal clad PCBs are widely used in light emitting diodes (LED) technologies to assist with heat dissipation and produce a specific illumination along with power converters in the telecom, industrial, high voltage regulator, power supplies, hybrid/electric motor control applications and photovoltaic products. The thickness of metal cores in PCB base is typically 30–125 mil, but thicker and thinner plates are available based on the customer’s application needs.

 

Copper clad PCB/heavy copper PCBs have the ability to dissipate heat away from components, which is why this type of PCB is in high demand. With increasing power requirements of products today, a copper PCB could be the right choice for your application. Common applications of a copper clad PCB/heavy copper PCB include power converters for telecom, industrial, power supplies and high voltage regulators, hybrid/electric motor control applications and general lighting applications

 

Ceramic PCBs can be used in high pressure, high temperature and high frequency applications, such as automotive and consumer electronics industries.

 

  • Highly hot and cold impact resistance

  • Low thermal expansion coefficient

  • Good thermal and electric conductivity

 

PTFE teflon PCBs are used when the electrical loss from standard FR4 is not acceptable. This materials low dielectric constant, low loss target and high melting temperature make it the perfect material for printed circuit boards that are to be used at high frequencies in applications such as military, medical, telecommunications and automotive.

 

  • Heat resistance

  • Non-viscous

  • Moisture resistance

  • Abrasion resistance

  • Corrosion resistance

 

Thermal clad PCBs (T Clad) have the ability to efficiently dissipate heat away from components. Metal clad PCBs can be aluminum, copper or a mixture of special alloys. The most common applications of thermal clad PCBs LED technologies including street safety applications (lighting, streetlights, etc.), general lighting applications, back light unit applications, automotive LED applications and power converters such as telecom, industrial, power supplies, high voltage regulator, photovoltaic and hybrid/electric motor control applications.

 

  • Lowering operating temperature

  • Reduced printed circuit board size

  • Longer component life

  • Increased durability

  • Increased power density

PCB Solutions

  • Flexible circuits

  • Rigid circuits

  • Rigid-flex circuits

  • Aluminum/metal clad

  • Copper and bondable PCBs

  • Ceramic PCBs

  • Teflon/metal PCBs

  • Thermal clad

  • Membrane circuits

 

Capabilities

  • Rapid prototyping

  • Rigid boards from 1 to 36 layers

  • Flex circuits from 1 to 6 layers

  • Controlled impedance: +/-8%

  • Thin laminate capability down to 4 mil

  • HAL, lead-free HAL, Flash gold, ENIG, ENEPIG,  gold finger plating, selective gold plating, Entek, immersion tin, immersion silver surface finishes

  • Silver ink through holes, silver and carbon ink jumper, carbon printing, peelable solder mask

  • Materials: CEM-1, CEM-3, FR-1, FR-2, FR-4, FR-5 (High Tg), High Tg Material (Tg = 180º C), BT, Rogers, Megtron, ISOLA, polyamide, and ceramic material

  • Finished board thickness:  0.25 mm/0.010 inch to 7.0 mm/0.275 in

  • Copper thickness up to 10 oz

  • Hole size: 0.1 mm/0.004 inch minimum (4 mil)

  • Trace size: 0.076 mm/0.003 inch minimum (3 mil)

  • Trace spacing: 0.076 mm/0.003 inch minimum (3 mil)

  • Aspect ratio: 12:1

PCB Solutions Flexible Circuits, Rigid Circuits, Rigid-Flex Circuits