Customized Encapsulation Process Development

Program Highlights

Customer designed a RF tracking device that had to withstand automated mail sorting processes and minimize susceptibility to normal handling of posted materials, as the device travelled along standard business and consumer mail and postal routes in North America and Europe.


The design incorporated a flexible circuit with a thin FR4 board material affixed to the flex circuit. The FR4 board required encapsulation at volume. The encapsulation had to meet weight and height restrictions while providing physical and environmental protection for the RF device. RF device functionality would be triggered at mail sorting stations where ingress/egress data would be recorded as the device entered and exited the mail sorting stations.


VEXOS implemented a proprietary process that enabled rapid curing of encapsulation while maintaining height and weight integrity and protection of the sensitive RF circuit. This resulted in a long term product line that has been running for over 10 years.


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